TESTING CAPABILITIES
ELECTRICAL TESTS:
MICROCIRCUITS
SEMICONDUCTORS(DIODE/TRANS)
PASSIVE(RES,CAP,IND)
Tolerance, DWV, IR, DC-Ikg
RELAY, SWITCHES(ON/OFF TESTS)
BOND STRENGTH
BURN -IN
CAPACITANCE
CONSTANT ACCELERATION
CONTACT RESISTANCE
DC RESISTANCE
DIELECTRIC WITHSTANDING
DPA
EXTERNAL VISUAL
HERMETICITY - FINE - LEAK
HERMETICITY - GROSS - LEAK
HUMIDITY
INSULATION RESISTANCE
INTERNAL VISUAL(dE-LID/dE-CAP) DIE VERIFICATION
INTERNAL WATER VAPOR(RGA)
LEAD CROSS SECTIONING
MARKING
MECHANICAL SHOCK
MOISTURE RESISTANCE
DRY-BAKE-MOISTURE-SENSITIVE PKG
PHYSICAL DIMENSIONS
PIND
PROGRAMMING(EPROM,PLD,ETC)
RADIOGRAPHY (X-RAY)
REAL TIME X-RAY
RESISTANCE TO SOLDERING HEAT
RESISTANCE TO SOLVENTS
SHOCK
SOLDER TINNING
SOLDERABILITY
STABILIZATION BAKE
TAPE & REEL
TEMPERATURE CYCLING
TERMINAL STRENGTH
TERMINAL RESISTANCE
THERMAL IMPEDANCE
THERMAL SHOCK
VIBRATION
XRF -
energy dispersive x-ray spectrometer
|